Koud inbedden Verbruiksmaterialen voor perfecte metallografische preparatie

QPREP KEM 15 PLUS is a universally applicable two-component cold mounting material based on a modified polyester resin. Due to its very low shrinkage, it is particularly suitable for boundary layer investigations.

Productvoordelen

• Very low shrinkage
• Hoge randscherpte
• Good chemical resistance
• Good mechanical machinability
• Easy dosage with enclosed measuring spoon
• Curing temperature : ca. 85-100 °C
• Uithardingstijd: ca. 25 min
• Hardheid (Shore D): 85
• Doorslijpsnelheid (slijpbaarheid): Zeer laag

Aanbevolen toepassingen

• Randonderzoek
• Middelharde tot harde materialen
• Curing by means of overpressure with pressure equipment possible, to minimize porosity and increase edge retention

QPREP KEM 20 is a universally applicable two-component cold mounting material based on a methyl methacrylate resin compound. Transparent mountings can be realized when curing under overpressure.

Productvoordelen

• Feasibility of transparent mountings by means of pressure equipment
• Good chemical resistance
• Good mechanical machinability
• Easy dosage with enclosed measuring spoon
• Curing temperature : ca. 100-120 °C
• Uithardingstijd: ca. 15 min
• Hardheid (Shore D): 84
• Doorslijpsnelheid (slijpbaarheid): gemiddeld

Aanbevolen toepassingen

• Target voorbereiding
• Zachte tot middelharde materialen

QPREP KEM 30 is a universal two-component cold mounting resin based on a methyl methacrylate resin compound. It is a fast curing resin, which is particularly suitable for high sample throughput.

Productvoordelen

• Semi-transparent
• Good chemical resistance
• Good mechanical machinability
• Easy dosage with enclosed measuring spoon
• Curing temperature : ca. 95-110 °C
• Uithardingstijd: ca. 5 min
• Hardheid (Shore D): 85
• Doorslijpsnelheid (slijpbaarheid): gemiddeld

Aanbevolen toepassingen

• Routine testing with high sample throughput
• Zachte tot middelharde materialen
• Curing by means of overpressure with pressure equipment possible, to minimize porosity

QPREP KEM 35 is a universally applicable two-component cold mounting material based on a methyl methacrylate resin compound. Due to its very low shrinkage and hardness, it is particularly suitable for edge examination on materials with higher hardness.

Productvoordelen

• Very low shrinkage
• Hoge randscherpte
• Very good mechanical machinability
• Easy dosage with enclosed measuring spoon
• Curing temperature : ca. 85-110 °C
• Uithardingstijd: ca. 12 min
• Hardheid (Shore D): 87
• Doorslijpsnelheid (slijpbaarheid): Zeer laag

Aanbevolen toepassingen

• Randonderzoek
• Mounting of hard materials
• Curing by means of overpressure with pressure equipment possible, to minimize porosity and increase edge retention

QPREP's MMA-vrije koud inbedmiddel KEM 60 is een twee-componenten systeem dat toepasbaar is op een breed scala aan materialen waar een verbod op of een allergische reactie op het gebruik van MMA-gebaseerde koud inbedmiddelen bestaat.

Productvoordelen

• Free of MMA
• Good chemical resistance
• Good mechanical machinability
• Curing temperature : ca. 95-110 °C
• Uithardingstijd: ca. 10 min
• Hardheid (Shore D): 85
• Doorslijpsnelheid (slijpbaarheid): laag

Aanbevolen toepassingen

• Routinematige montages
• Very wide range of application
• Curing by means of overpressure with pressure equipment possible, to minimize porosity

Het QPREP SEM 5000 koud inbeddingsmateriaal van QPREP zorgt voor een hoogwaardig inbeddingsresultaat met een lage krimp en een hoge randscherpte. Bovendien is QPREP SEM 5000 een elektrisch geleidende verbinding op basis van gemodificeerd methylmethacrylaat met fijne koperdeeltjes.

Productvoordelen

• Elektrogeleidend
• Contains copper particles
• Curing temperature : 85 - 110 °C
• Uithardingstijd: 10 min
• Hardheid (Shore D): 91
• Doorslijpsnelheid (slijpbaarheid): Zeer laag

Aanbevolen toepassingen

• SEM-onderzoeken
• Elektrolytisch polijsten

QPREP QPOX 90 is a transparent two-component cold mounting material based on an epoxy resin. Due to its good flowability, it is well suited for the pre-potting of specimens with filigree and complex geometries.

Productvoordelen

• Good transparency
• Zeer geringe spleetvorming
• Low viscosity
• Suitable for vacuum infiltration
• Curing temperature : RT to approx. 50 °C
• Uithardingstijd: 16 - 24 Uren
• Hardheid (Shore D): 79
• Doorslijpsnelheid (slijpbaarheid): hoog

Aanbevolen toepassingen

• Routinematige montages
• Toepasbaar voor een verscheidenheid aan materialen
• Target voorbereiding
• Infiltration of porous materials
• Pre-potting of assembled printed circuit boards to fix electronic components prior to cutting.
• Mounting of low hardness material

Het QPREP koud inbedmiddel QPOX 90 en QPOX 92 zijn tweecomponenten epoxyharsen die geschikt zijn voor vacuüm infiltratie en worden gebruikt voor het inbedden van filigraan preparaten en het prepareren van targets.

Productvoordelen

• Very good transparency
• Zeer geringe spleetvorming
• Low viscosity
• Suitable for vacuum infiltration
• Curing temperature : RT to approx. 35 °C
• Uithardingstijd: 12 - 13 Uren (50% faster than QPOX 90)
• Hardheid (Shore D): 81
• Doorslijpsnelheid (slijpbaarheid): gemiddeld

Aanbevolen toepassingen

• Routinematige montages
• Toepasbaar voor een verscheidenheid aan materialen
• Target preparations of defects in coating surfaces
• Infiltration of porous materials
• Pre-potting of assembled printed circuit boards to fix electronic components prior to cutting.
• Mounting of low hardness material

In this video, you’ll discover the benefits Qpox 93 has to offer!

Qpox 93 is a low-viscosity and crystal-clear two-component cold mounting agent based on epoxy resin. Qpox 93 enables absolutely transparent and gap-free mounting and, with a curing time of around 8-12 hours, is also ideal for the preparation of routine samples. Free of solvents, DETA and CMR substances, it enables safer handling in everyday use, ideal for e.g. manual target preparations. 

Productvoordelen

• Excellent adhesion and very low gap formation
• Very good transparency
• Free from solvents, DETA and CMR substances 
• Low-bubble mountings
• Low viscosity
• Suitable for vacuum infiltration
• Curing temperature: RT up to 45°C
• Uithardingstijd: 8 - 12 Uren
• Hardheid (Shore D): 81
• Doorslijpsnelheid (slijpbaarheid): gemiddeld

Aanbevolen toepassingen

• Low-gap and transparent preparations 
• Routinematige inbeddingen
• Can be used for a wide range of materials
• Suitable for vacuum infiltration of coated surfaces, for example for defect investigation 
• Pre- and partial potting as well as mounting and final preparation of assembled circuit boards 
• For delicate and sensitive samples of more complex geometries and workpieces of low to medium hardness 

Qpox 94 is a low-viscosity and transparent two-component epoxy-based cold mounting resin, ideal for samples with delicate and complex geometries. It is particularly suitable for sensitive and porous surfaces as well as target preparations. With a curing time of about 9 hours Qpox 94 allows transparent and gap-free mounting and preparation on the same day.

Productvoordelen

• Excellent adhesion and very low gap formation
• Very good transparency
• Low-bubble mountings
• Low viscosity
• Suitable for vacuum infiltration
• Curing temperature: RT up to 45°C (Tmax = 100 to 140°C)
• Curing time: 9 h at RT (25% faster than Qpox 92), 3 h at 45°C 
• Hardheid (Shore D): 80
• Removal rate: High

Aanbevolen toepassingen

• Low-gap and transparent preparations on the same day
• Can be used for a wide range of materials
• For vacuum infiltration of porous materials and material surfaces, such as metal foams, porous ceramic support material or samples with corrosion layers
• Mountings and target preparations of assembled PCBs
• For filigree and sensitive specimens of more complex geometries and low-hardness workpieces

QPREP Qpox 96 Rapid is a fast-curing two-component epoxy resin from QATM. With a curing time of less than 4 hours, it allows sample preparation to be carried out within one day. Due to a maximum curing temperature of less than 120 °C, Qpox 96 Rapid is also suitable for heat-sensitive materials, such as assembled printed circuit boards. Due to its good hardness, low viscosity, good adhesion and transparency, it is ideal for routine target preparation of all types of samples. Designed with a focus on the EHS profile, it is free of DETA and CMR substances and enables safe and efficient materialographic preparation.

Productvoordelen

• Excellent adhesion, very low gap formation
• Good transparency
• Free of DETA and CMR substances
• Very low viscosity, penetrates cracks and pores well
• Suitable for vacuum infiltration
• Curing temperature: at RT (23°C) up to ~120°C
• Curing time: ~2-4 h
• Hardness (Shore D): Up to 84
• Removal rate: Medium

Aanbevolen toepassingen

• Low-gap and transparent preparations
• Routine mountings, applicable to a wide range of materials
• Suitable for vacuum infiltration of coated surfaces (e.g. spray coatings), defect investigation
• Good crack and pore permeability enables mounting of (micro-)porous materials
• Partial potting, mounting and target preparation of assembled printed circuit boards in the shortest possible time
• Filigree/sensitive specimens of more complex geometries

Het kiezen van een koud inbedvorm met de juiste maat en het juiste materiaal kan het resultaat van uw inbedding optimaliseren. De inbedvormen moeten herbruikbaar en chemisch resistent zijn en moeten het verwijderen van het ingebedde preparaat vergemakkelijken. QPREP inbedmallen bieden u mallen in verschillende vormen, afmetingen en materialen:

Qmould Grey,  without chamfer

• Two-piece design with practical handles and flexible material for easy removal and demoulding
• Compatible with epoxy resins, ideal for low-shrinkage resins like Qpox; alternative to silicone moulds

Qmould Clear,  without chamfer

• High UV transparency for optimal curing of Qprep UV resins, suitable for UV and acrylic resins
• Handles facilitate sample placement; direct alternative to PP mounting moulds

Qmould White,  without chamfer

• Durable design with resilient material and handles, ideal for high heat
• Cost-effective alternative to Teflon mounting moulds, suitable for polyester and acrylic resins

PTFE, beveled edge, round

• Very long service life and shape stability
• High strength, for particularly flat mountings

Silicone rubber, round or rectangular, beveled edge

• Flexibility of the material enables easy demoulding after curing
• Thick-walled mould, therefore, not recommended for light curing
• Without removable base

Polypropylene,  without chamfer

• Semi-transparent, therefore suitable for light curing
• With removable base for easy demoulding after curing

Polyethylene, round,  without chamfer

• Opaque, therefore, not recommended for light curing
• With removable base for easy demoulding after curing

When cold mounting porous specimens it is purposeful to infiltrate them under vacuum, with a low viscosity mounting medium (epoxy resins). The QPREP infiltration device offers a solution for mounting under vacuum.

For transparent cold mounting using methyl methacrylate, these must be cured in a pressure device under positive pressure (2 - 2.5 bar). This increases the boiling point of the mounting material and suppresses the formation of gas bubbles during polymerization. The QPREP Pressure unit is best suited for this purpose.

Productvoordelen

• Infiltration of porous materials
• Reinforcement of fragile materials
• Clear/transparent mounting possible with methyl methacrylate

Aanbevolen toepassingen

• Infiltration device for mounting porous samples with epoxy resin (Qpox 90 / 92 / 94)
• Pressure device for mounting with methyl methacrylate (KEM 15, 20, 30, 35, 60 and QPREP SEM 5000)

Het mengen van verschillende componenten van uw hars en het nauwkeurig positioneren van uw preparaten beïnvloedt de kwaliteit van uw inbedding. Daarom ondersteunt QPREP's brede assortiment koud inbedmiddelen en accessoires u bij het mengen van uw koud inbedmiddelcomponenten, het fixeren en het correct positioneren van uw preparaten in de koud inbedvormen.

Toebehoren

• Mengbekers en spatels
• Inbedhulpen
• Doseerlepels
• Staal- en plastic clips